LTE Cat 3 / Cat 4 4G LTE Module HL7548 with Intel XMM7160 Chipset
AirPrime® HL7548 Specifications
| Cellular | • LTE Cat 3/Cat4 |
| B2,B4,B5,B17 |
| •Peak Download/ Upload Rate |
| (100/50 Mbps) |
| • Intel XMM 7160 |
| • LTE Only Verizon |
| • LTE triple band Cat3/Cat4 |
| • FDD LTE |
| • DL 2X2 |
| Physical Characteristics | • 23 X 22 X 2.5 [mm] |
| Weight: | • 3.5g |
| Temperature ranges: | • Storage Temperature:–40C to +85C |
| Approval & Certification | • FCC, PTCRB, GCF |
| • AT&T |
The AirPrime HL7519, HL7548 and HL7588 belong to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provide data connectivity on LTE, HSDPA and HSUPA networks.
Sierra Wireless AirPrime® HL7548 embedded module offers LTE only coverage for machine-to-machine (M2M) applications such as healthcare, point of sale terminals, fleet management, tracking, and consumer electronics.
Key differentiators:
· Smallest 2G to 4G pin-to-pin compatable module on the market
· Common form factor with optional snap-in socket to change modules anytime
· Low-power consumption and enhanced RF performance
· FOTA (firmware over-the-air) support
Compact: Smallest 2G-4G module on the market
The HL Series is the smallest module on the market sharing a common form factor across 2G, 3G, and 4G technologies. Now, with just one PCB design, device manufacturers can easily integrate voice and data connectivity and deploy in any region, on any wireless mobile network.
Flexible: Solder down or choose the snap-in socket to switch modules any time
The compact form factor offers the choice of soldering down the module for efficient high-volume production or, using a snap-in socket on the same solder pads for total flexibility in prototyping or smaller volume runs. The innovative snap-in socket allows device manufacturers to deploy or change modules at any point in the production and product life cycles.
Future Proof: Intelligent pin-to-pin compatibility to support evolving technologies
The core and extension pins on the common form factor enables forward and backward compatibility between the different 2G, 3G, and 4G module variants. This means that the mechanical pin location delivers the same function across the series. The optional custom pins allow for new features as technology evolves making it the most future proof module on the market.
Upgradeable: Easy to integrate and manage
The HL Series can be managed remotely with AirVantage® Management Service, enabling device manufacturers to securely upgrade device firmware over-the-air. This can extend the life of your products and solutions by future-proofing remote assets, expanding service quality, and saving customers time and operating costs.
Table 2. AirPrime HL7519, HL7548 and HL7588 Features
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LTE Cat 3 / Cat 4 4G LTE Module HL7548 with Intel XMM7160 Chipset Images
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